JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, and the Open NAND Flash Interface Workgroup (ONFI) today announced the publication of JESD230 NAND Flash Interface Interoperability Standard (Package). This jointly developed document defines a standard for NAND flash device interface interoperability. JESD230 is available for free download from both www.jedec.org and www.onfi.org.

JESD230 addresses signaling descriptions, packages, definitions, abbreviations and conventions, and is backwards compatible with existing technologies to the greatest degree possible. The standard will help enable the design of interoperable systems that can support Asynchronous SDR, Synchronous DDR and Toggle DDR NAND flash devices.

“By joining forces to develop and publish JESD230, ONFI and JEDEC have responded to the industry’s need for interoperability among NAND vendors, which will enable even broader use of NAND flash in a wide variety of applications,” said Amber Huffman, senior principal engineer, Intel Storage Technologies Group and chairperson for the ONFI Workgroup Board of Directors.

Added Cecil Ho, Chairman of JEDEC’s JC-42.4 Subcommittee, “JEDEC is delighted to have collaborated with ONFI to develop and publish the first joint NAND Flash Interoperability Standard focused on packages, which we believe will be welcome news to NAND flash vendors and end users.”

About JEDEC

JEDEC is the leading developer of standards for the microelectronics industry. More than 4,000 participants, appointed by nearly 300 companies, work together in 50 JEDEC committees to meet the needs of every segment of the industry, manufacturers and consumers alike. The publications and standards that they generate are accepted throughout the world. All JEDEC standards are available online, at no charge. For more information, visit www.jedec.org.

About ONFI

The ONFI Working Group is dedicated to simplifying integration of NAND Flash memory into consumer electronics (CE) applications and computing platforms. Before the advancements made by the working group, use of NAND Flash in these end-use applications was hampered by the lack of sufficient standardization. To support a new NAND Flash component on a platform, host software and hardware changes were often required. Implementing these changes was extremely costly due to the new testing cycle required, which led to slower rates of adoption for new NAND Flash components. ONFI aims to remedy that problem and speed time to market for NAND Flash based applications.

The ONFI Working Group was formed in May 2006 and currently has more than 100 member companies. ONFI’s founding companies include Intel Corporation, Micron Technology, Inc., Phison Electronics Corporation, SanDisk, SK hynix, Sony Corporation and Spansion.