Comments
yourfanat wrote: I am using another tool for Oracle developers - dbForge Studio for Oracle. This IDE has lots of usefull features, among them: oracle designer, code competion and formatter, query builder, debugger, profiler, erxport/import, reports and many others. The latest version supports Oracle 12C. More information here.
Cloud Expo on Google News
SYS-CON.TV
Cloud Expo & Virtualization 2009 East
PLATINUM SPONSORS:
IBM
Smarter Business Solutions Through Dynamic Infrastructure
IBM
Smarter Insights: How the CIO Becomes a Hero Again
Microsoft
Windows Azure
GOLD SPONSORS:
Appsense
Why VDI?
CA
Maximizing the Business Value of Virtualization in Enterprise and Cloud Computing Environments
ExactTarget
Messaging in the Cloud - Email, SMS and Voice
Freedom OSS
Stairway to the Cloud
Sun
Sun's Incubation Platform: Helping Startups Serve the Enterprise
POWER PANELS:
Cloud Computing & Enterprise IT: Cost & Operational Benefits
How and Why is a Flexible IT Infrastructure the Key To the Future?
Click For 2008 West
Event Webcasts
FCI and 3M Announce Second-source Agreement for HPCE and HP2 Power Products

FCI, a leading supplier of power products and interconnect systems, and 3M have entered into a second-source agreement covering the High Power Card Edge (HPCE®) and HP2 power product families.

“We are excited about this opportunity,” said Dong Yu, global power portfolio director at FCI. “Working with 3M will drive the standard for low-profile, high-efficiency power connectors and cable assemblies. HPCE already has great traction in the market and HP2 will further extend the family with innovative, two-piece solutions for board-to-board and cable-to-board applications.”

“3M is extremely pleased to work with FCI by providing the industry with a second source of FCI’s innovative HPCE and HP2 power connectors and cable assemblies,” said David Schneider, global business manager for interconnect, 3M Electronic Solutions Division. “FCI’s expertise in power product design and 3M’s expertise in connector technology and material science is a good match to offer a standard, dual-sourced power solution.”

The HPCE connector is a next-generation power card edge connector for demanding applications requiring high linear current density and low power loss. HPCE offers a low profile height (2.8 mm for straddle mount and 7.5 mm for right angle) and is based on very cost-effective and highly reliable stamped-and-formed power contact technology similar to other power solutions from FCI.

The HPCE connector incorporates an innovative power contact and housing design that permits a more compact and lower profile package for demanding AC and DC power supply and/or add-in card applications. HPCE’s low profile height (for maximized airflow), significantly increased linear current density and low contact resistance characteristics are ideal for next generation 1U/2U servers, storage enclosures, telecommunications equipment and datacom/networking equipment.

The innovative HPCE cable-to-card edge is available with the same desirable features as the standard HPCE board mount product but is focused on power distribution applications via cabling. It includes high power (10 – 14 AWG wire) and low power (14 – 16 AWG wire) contact options as well as integrated signal contacts (22 – 26 AWG wire). The modular tooling approach maximizes flexibility to meet a wide range of power distribution requirements including bus bar attachment. The integrated latching option makes it ideal for high shock-and-vibration environments.

The HP2 product is similar to HPCE but utilizes a two-piece design (header-to-receptacle connectors/cable assemblies). Integrated guide features make it ideal for blindmate applications where system guidance is not readily available. The HP2 product is available in board-to-board and cable-to-board configurations and includes power contacts for power distribution and signal contacts for power control.

3M anticipates having the connectors available in early 2013.

About 3M Electronic Solution Division – Interconnect
3M Electronic Solutions Division’s Interconnect business offers a variety of innovative connectors, cables and cable assemblies, embedded capacitance materials and Textool brand test and burn-in sockets for component engineers and designers in the electronics industry. For more information about 3M’s interconnect solutions, visit: http://www.3Mconnectors.com. Information about 3M Company is available online.

About FCI
With operations in 30 countries, FCI is a leading manufacturer of connectors. Our 14,000 employees are committed to providing customers with high-quality, innovative products for a wide range of consumer and industrial applications. For more information: http://www.fci.com

3M and Textool are trademarks of 3M Company. HPCE® and HP2® are registered trademarks of FCI. All other trademarks, names and brands listed herein are property of their respective owners and/or companies.

About Business Wire
Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Cloud Developer Stories
This white paper digs deep into the reasons testing mobile apps is fundamentally harder than traditional web or desktop applications. A collaboration by Tina Zhuo and Dennis Schultz from IBM along with Yoram Mizrachi from Perfecto Mobile and John Montgomery from uTest, these expe...
CodeFutures, a provider of agile Big Data technologies, on Tuesday announced the release of Cory Isaacson’s newest book, “Understanding Big Data Scalability.” Isaacson is the CEO/CTO for CodeFutures and an industry-leading innovator of data management software. “Understanding Big...
Internet of @ThingsExpo, taking place Nov 4-6, 2014, at the Santa Clara Convention Center in Santa Clara, CA, is co-located with 15th Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry players in the world. The Internet of...
Cloud Expo, Inc. has announced the first annual "Iron Cloud IoT Shootout" to be held on November 6, 2014 at Cloud Expo Silicon Valley at Santa Clara Convention Center in California. The "Iron Cloud IoT Shootout" will be a live competition among all the key Cloud Computing platfor...
Cloud Computing is evolving into a Big Three of Amazon Web Services, Google Cloud, and Microsoft Azure. Cloud 360: Multi-Cloud Bootcamp, being held Nov 4–5, 2014, in conjunction with 15th Cloud Expo in Santa Clara, CA, delivers a real-world demonstration of how to deploy and co...
Subscribe to the World's Most Powerful Newsletters
Subscribe to Our Rss Feeds & Get Your SYS-CON News Live!
Click to Add our RSS Feeds to the Service of Your Choice:
Google Reader or Homepage Add to My Yahoo! Subscribe with Bloglines Subscribe in NewsGator Online
myFeedster Add to My AOL Subscribe in Rojo Add 'Hugg' to Newsburst from CNET News.com Kinja Digest View Additional SYS-CON Feeds
Publish Your Article! Please send it to editorial(at)sys-con.com!

Advertise on this site! Contact advertising(at)sys-con.com! 201 802-3021



SYS-CON Featured Whitepapers
ADS BY GOOGLE

Breaking Cloud Computing News
Research and Markets (http://www.researchandmarkets.com/research/mvjp5n/video) has announced the add...