Comments
yourfanat wrote: I am using another tool for Oracle developers - dbForge Studio for Oracle. This IDE has lots of usefull features, among them: oracle designer, code competion and formatter, query builder, debugger, profiler, erxport/import, reports and many others. The latest version supports Oracle 12C. More information here.
Cloud Expo on Google News
SYS-CON.TV
Cloud Expo & Virtualization 2009 East
PLATINUM SPONSORS:
IBM
Smarter Business Solutions Through Dynamic Infrastructure
IBM
Smarter Insights: How the CIO Becomes a Hero Again
Microsoft
Windows Azure
GOLD SPONSORS:
Appsense
Why VDI?
CA
Maximizing the Business Value of Virtualization in Enterprise and Cloud Computing Environments
ExactTarget
Messaging in the Cloud - Email, SMS and Voice
Freedom OSS
Stairway to the Cloud
Sun
Sun's Incubation Platform: Helping Startups Serve the Enterprise
POWER PANELS:
Cloud Computing & Enterprise IT: Cost & Operational Benefits
How and Why is a Flexible IT Infrastructure the Key To the Future?
Click For 2008 West
Event Webcasts
Research and Markets: Reverse Costing Report of the VGA Camera Module Supplied by ST Microelectronics

Research and Markets (http://www.researchandmarkets.com/research/7xtptx/stmicro) has announced the addition of the "STMicro Wafer-Level Camera - WLP CIS + Heptagon WL-Optic Reverse Costing" report to their offering.

System Plus Consulting is proud to publish the reverse costing report of the VGA Camera Module supplied by ST Microelectronics for the Nokia 2330 mobile phone. This camera module integrates an 2.2µm pixel CMOS Image Sensor (CIS) from STMicro. The CIS die is manufactured using a CMOS technology with a 0.18µm process. The CIS is Wafer-Level Packaged (WLP) using a TSV "via last" technology. The optical module comes from Heptagon and is manufactured with a wafer-level approach.

- Physical Analysis of the Camera and the CMOS Image Sensor

- Step by Step Reconstruction of the Process Flow

- Cost of Manufacturing and Estimation of Selling Price

This report provides complete teardown of the camera module with:

- Detailed photos

- Material analysis

- Schematic assembly description

- Manufacturing Process Flow

- In-depth economical analysis

- Manufacturing cost breakdown

- Selling price estimation

Key Topics Covered:

Glossary

Overview/Introduction

- Executive Summary

- Reverse Costing Methodology

Companies Profiles

- CMOS Image Sensors. Volume Shipments

- STMicroelectronics Profile

- Heptagon Profile

Nokia 2330 Teardown

Physical Analysis

- Camera Module Views & Dimensions

- Camera X-Ray

- Camera Module Disassembly

- CIS Views & Dimensions

- CIS Markings

- CIS Bonding

- CIS Microlenses

- CIS Pixels

- CIS Back view

- Camera Module Cross-section

- Package Cross-section

- Optical Module Cross-section

- CIS Packaging Cross-section

- CIS Cross-section

Manufacturing Process Flow

- CIS Process Flow

- CIS Wafer-level packaging Process Flow

- Description of the CIS Wafer Fabrication Unit

- WL-Optic Process Flow

- Description of the WL-Optic Wafer Fabrication Unit

Cost Analysis

- CIS FEOL + BEOL Cost

- CIS Front-End Cost

- CIS Back-End 0 : 1st Probe Test & Optical Test

- CIS WLP Cost

- CIS WLP Cost per Process Steps

- CIS WLP : Equipment Cost per Family

- CIS WLP : Material Cost per Family

- CIS Die Cost

- WL-Optic Front-End Cost

- WL-Optic Cost per Process Steps

- WL-Optic : Equipment Cost per Family

- WL-Optic : Material Cost per Family

- WL-Optic : Test, dicing and assembly

- WL-Optic Price

- Back-End : Final Packaging & Test

- Camera Module Cost (CIS + WLO + Packaging)

Estimated Price Analysis Conclusion

For more information visit http://www.researchandmarkets.com/research/7xtptx/stmicro

About Business Wire
Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Cloud Developer Stories
Identity is in everything and customers are looking to their providers to ensure the security of their identities, transactions and data. With the increased reliance on cloud-based services, service providers must build security and trust into their offerings, adding value to cus...
CenturyLink has announced that application server solutions from GENBAND are now available as part of CenturyLink’s Networx contracts. The General Services Administration (GSA)’s Networx program includes the largest telecommunications contract vehicles ever awarded by the federa...
SYS-CON Events announced today that Isomorphic Software will exhibit at DevOps Summit at 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. Isomorphic Software provides the SmartClient HTML5/AJAX pl...
"We've discovered that after shows 80% if leads that people get, 80% of the conversations end up on the show floor, meaning people forget about it, people forget who they talk to, people forget that there are actual business opportunities to be had here so we try to help out and ...
"When you think about the data center today, there's constant evolution, The evolution of the data center and the needs of the consumer of technology change, and they change constantly," stated Matt Kalmenson, VP of Sales, Service and Cloud Providers at Veeam Software, in this SY...
Subscribe to the World's Most Powerful Newsletters
Subscribe to Our Rss Feeds & Get Your SYS-CON News Live!
Click to Add our RSS Feeds to the Service of Your Choice:
Google Reader or Homepage Add to My Yahoo! Subscribe with Bloglines Subscribe in NewsGator Online
myFeedster Add to My AOL Subscribe in Rojo Add 'Hugg' to Newsburst from CNET News.com Kinja Digest View Additional SYS-CON Feeds
Publish Your Article! Please send it to editorial(at)sys-con.com!

Advertise on this site! Contact advertising(at)sys-con.com! 201 802-3021



SYS-CON Featured Whitepapers
ADS BY GOOGLE