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90 Electronic Manufacturing and Mounting Technology Companies to Exhibit at Internepcon's 'Rising Innovation' - Featuring Small to Medium Enterprises

'Rising Innovation' - announcing focus on SMEs (small to medium enterprises) for the 42nd INTERNEPCON JAPAN electronic manufacturing and mounting technology exhibition, to take place from Wednesday, January 16 thru Friday 18, 2013 at Tokyo Big Site, hosted by the Organization for Small & Medium Enterprises and Regional Innovation, JAPAN (SME Support, JAPAN). Ninety of Japan's domestic electronics manufacturing and mounting technology related SMEs will be on hand exhibiting their wares at this event.

In the SME zone, SMEs that are boldly taking on the challenge of international expansion aim to provide a forum in order to make in-roads into international markets through exhibits and presentations of their fine products, technologies and business models.

The world's first moldable heat-resistant inorganic EL insertable to withstand heat up to 260 degrees (MPT Co., Ltd.)
The world's only innovative foreign matter anti-static device (TRINC Corp.)
World's first thin-film thermal property measuring devices able to measure heat properties of metal thin-film, ceramic thin-film, organic thin-film consisting of thicknesses between 10nm to 10μm with high precision (PicoTherm Corp.)
Available for sale for the first time, non-destructive Amamir sugar content scanner and wood scanner. (Towa Electric Industry Co., Ltd.)
World's smallest ultra compact precision liquid membrane testing apparatus for organic-material. (Techno-machine Corp.)
The world's first miniature plastic paradox gear reduction (i COMES LAB Co., Ltd.)

Exhibits such as the above-mentioned companies, along with other state-of-the-art technology SMEs will be assembled. Exhibitors will also be taking the stage in the zone offering presentations during the entire exhibition.

Please check the website for more details: http://www.smrj.go.jp/nepcon2013/

Summary

Name
42nd INTERNEPCON JAPAN - SME zone, 'Rising Innovation'
Event Dates
Wednesday, January 16th to Friday, January 18th 2013.
10:00~18:00 (10:00~17:00 on Jan. 18)
Venue
Tokyo Big Site, East Hall 6 (3-11-1 Ariake, Koto-ku, Tokyo)
Hosted by:
Organization for Small & Medium Enterprises and Regional Innovation, JAPAN (SME Support, JAPAN)
Number of small and medium-sized exhibitors in the zone
90 companies/90 booths (total of 1,830 companies throughout Internepcon)
Visitors
Approximately 90,000 people (expected visitors to Internepcon Japan)

Electrical and electronic equipment manufacturers, semiconductor manufacturers, assembly, automotive and electrical equipment manufacturers, medical device manufacturers, equipment manufacturers/FA industrial equipment, video equipment manufacturers, EMS (electronic manufacturing services)/ sub-contractors, mobile device (such as smartphone) manufacturers, computer manufacturers (including peripherals) , aerospace and marine equipment manufacturers, amusement equipment manufacturers, optical equipment manufacturers etc.

Exhibitors' Target Markets
Mounters, rework/repair apparatus, mask, taping machines, carrier tape casting machines, Laser cutting machines, precision welding machines, circuit board splitting machines, joining machines/cable ties, mechanical parts, inserters, cream solder printing machines, dispensers, carrier tape, part feeders, marking systems/inks, punching/pressing machines, crimping machines, inspection/testing/measurement devices, industrial and business development projects, and other electronic manufacturing related wares.

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