Comments
yourfanat wrote: I am using another tool for Oracle developers - dbForge Studio for Oracle. This IDE has lots of usefull features, among them: oracle designer, code competion and formatter, query builder, debugger, profiler, erxport/import, reports and many others. The latest version supports Oracle 12C. More information here.
Cloud Expo on Google News
SYS-CON.TV
Cloud Expo & Virtualization 2009 East
PLATINUM SPONSORS:
IBM
Smarter Business Solutions Through Dynamic Infrastructure
IBM
Smarter Insights: How the CIO Becomes a Hero Again
Microsoft
Windows Azure
GOLD SPONSORS:
Appsense
Why VDI?
CA
Maximizing the Business Value of Virtualization in Enterprise and Cloud Computing Environments
ExactTarget
Messaging in the Cloud - Email, SMS and Voice
Freedom OSS
Stairway to the Cloud
Sun
Sun's Incubation Platform: Helping Startups Serve the Enterprise
POWER PANELS:
Cloud Computing & Enterprise IT: Cost & Operational Benefits
How and Why is a Flexible IT Infrastructure the Key To the Future?
Click For 2008 West
Event Webcasts
Telit Introduces Two Qualcomm Technologies, Inc. Based Modules Expanding 3G HSPA and HSPA+ Offerings for Global M2M Markets

Telit Wireless Solutions, a leading global vendor of high-quality machine-to-machine (M2M) modules and value-added services, today announced the introduction of the UE910 V2 HSDPA and HE910 V2 HSPA+ modules based on Qualcomm Technologies, Inc. chipsets, each to be banded for European and North American markets. Both products feature dual-band 3G and GSM/GPRS/EDGE support. The entry-level 3G UE910 V2 is based on Qualcomm Technologies' QSC6270 chipset and delivers a top 3.6Mbps downlink data rate. The HE910 V2 is based on Qualcomm Technologies' MDM6200 chipset and delivers up to 14.4Mbps downlink and 5.76Mbps uplink data rates.

The new products are fully compatible with Telit's xE910 family and can be easily dropped into existing or planned designs for xE910 modules requiring no additional rework. Positioned at entry-level and mid-range respectively, the new Qualcomm Technologies-based UE910 V2 and HE910 V2 modules enable the Telit xE910 family to enhance cross-technology compatibility with its other popular global air-interface technologies. The application of the Qualcomm Technologies chipsets improves interchangeability between CDMA (1xRTT, EV-DO) and UMTS (HSDPA, HSPA+) variants making the adaptation of customer applications to regional technical requirements quick and easy, minimizing time to market and total cost of ownership.

The QSC6270-based UE910 V2 is to be positioned as a 2G to 3G migration path product, and includes high-value features such as analog audio, making it ideal for applications from home and commercial security and surveillance systems, to asset monitoring, logistics, and mass-transit monitors. Telit is planning a UE910 V2 variant based on QSC6270-Turbo with additional support for Java J2ME 3.2 and eCall.

The MDM6200-based HE910 V2 is fully digital audio capable, supports both GPS and GLONASS location technologies, and provides full-duplex PCM input and output. These features combined with the up to 14.4Mpbs downlink and 5.76Mbps uplink data rates make the product ideal for applications such as a video surveillance and security, and other emerging applications areas such as healthcare, Smart Home, and Smart Grid.

Both the UE910 V2 and HE910 V2 will be available in local band-group variants as required for all major carriers and partner networks in North America and Europe. The Qualcomm Technologies-based products will be available in North America with 850/1900MHz and in Europe with 900/2100MHz dual-band combinations. Both regional variants will be available in data-only as well as data & voice variants.

"The Qualcomm Technologies-based entry-level 3G UE910 V2 and mid-range HE910 V2 are Telit's new 3G products launched in response to increasing demand for dual-band HSDPA, and HSPA+ modules," said Dominikus Hierl, chief marketing officer at Telit Wireless Solutions. "They come to address the need from application areas and regions requiring easy interchangeability between CDMA or UMTS lines of air interface technology, particularly in United States, Europe and key opportunities."

"Qualcomm Technologies' fully-integrated QSC6270, QSC6270-Turbo and MDM6200 chipsets support the bandwidth and feature requirements of a broad range of M2M applications, and we are pleased to enable HSDPA, and HSPA+ products in the xE910 family," said Nakul Duggal, vice president of product management for IOE, Qualcomm Technologies. "By using Qualcomm Technologies' Gobi 3G solutions in its xE910 product family, Telit will be able to offer its customers the technology flexibility to address M2M products and drive 2G to 3G migration in Europe and North America."

About Telit

Telit Wireless Solutions is a brand of Telit Communications PLC (AIM: TCM), an enabler of machine-to-machine (M2M) communications worldwide providing wireless module technology, M2M managed services and value added services, including connectivity. Exclusively dedicated to M2M with more than 12 years of experience in the market, the company constantly enhances its technology leadership with six R&D centers around the globe. Telit offers an extensive portfolio of the highest quality cellular, short-range RF, and GNSS modules, available in over 80 countries. By supplying scalable products that are interchangeable across families, technologies, and generations, Telit is able to keep development costs low and protect customers' design investments. In addition, Telit is the only module provider in the market today to offer a value added services bundle including connectivity dedicated to simplifying the deployment of M2M applications.

About Business Wire
Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Cloud Developer Stories
Compute virtualization has been transformational, yet security policy implementation and enforcement has lagged behind in agility and automation. There are a number of key considerations when implementing policy in private and hybrid clouds. In his session at 15th Cloud Expo, H...
Samsung VP Jacopo Lenzi, who headed the company's recent SmartThings acquisition under the auspices of Samsung's Open Innovaction Center (OIC), answered a few questions we had about the deal. This interview was in conjunction with our interview with SmartThings CEO Alex Hawkinson...
How do APIs and IoT relate? The answer is not as simple as merely adding an API on top of a dumb device, but rather about understanding the architectural patterns for implementing an IoT fabric. There are typically two or three trends: Exposing the device to a management framewo...
SYS-CON Events announced today that SOA Software, an API management leader, will exhibit at SYS-CON's 15th International Cloud Expo®, which will take place on November 4–6, 2014, at the Santa Clara Convention Center in Santa Clara, CA. SOA Software is a leading provider of API M...
SYS-CON Events announced today that Utimaco will exhibit at SYS-CON's 15th International Cloud Expo®, which will take place on November 4–6, 2014, at the Santa Clara Convention Center in Santa Clara, CA. Utimaco is a leading manufacturer of hardware based security solutions that...
Subscribe to the World's Most Powerful Newsletters
Subscribe to Our Rss Feeds & Get Your SYS-CON News Live!
Click to Add our RSS Feeds to the Service of Your Choice:
Google Reader or Homepage Add to My Yahoo! Subscribe with Bloglines Subscribe in NewsGator Online
myFeedster Add to My AOL Subscribe in Rojo Add 'Hugg' to Newsburst from CNET News.com Kinja Digest View Additional SYS-CON Feeds
Publish Your Article! Please send it to editorial(at)sys-con.com!

Advertise on this site! Contact advertising(at)sys-con.com! 201 802-3021



SYS-CON Featured Whitepapers
ADS BY GOOGLE

Breaking Cloud Computing News
MOUNTAIN VIEW, CA and MANCHESTER, UNITED KINGDOM--(Marketwired - October 22, 2014) - IIX Inc., a lea...