Comments
yourfanat wrote: I am using another tool for Oracle developers - dbForge Studio for Oracle. This IDE has lots of usefull features, among them: oracle designer, code competion and formatter, query builder, debugger, profiler, erxport/import, reports and many others. The latest version supports Oracle 12C. More information here.
Cloud Expo on Google News
SYS-CON.TV
Cloud Expo & Virtualization 2009 East
PLATINUM SPONSORS:
IBM
Smarter Business Solutions Through Dynamic Infrastructure
IBM
Smarter Insights: How the CIO Becomes a Hero Again
Microsoft
Windows Azure
GOLD SPONSORS:
Appsense
Why VDI?
CA
Maximizing the Business Value of Virtualization in Enterprise and Cloud Computing Environments
ExactTarget
Messaging in the Cloud - Email, SMS and Voice
Freedom OSS
Stairway to the Cloud
Sun
Sun's Incubation Platform: Helping Startups Serve the Enterprise
POWER PANELS:
Cloud Computing & Enterprise IT: Cost & Operational Benefits
How and Why is a Flexible IT Infrastructure the Key To the Future?
Click For 2008 West
Event Webcasts
Spreadtrum Adopts STATS ChipPAC's Innovative Packaging for China's Smartphone Market
eWLB Packaging Technology Platform Delivers Transformative Performance and Form Factors at Competitive Cost for Spreadtrum's Mobile Chipsets

SINGAPORE 23 JANUARY 2013, UNITED STATES -- (Marketwire) -- 01/23/13 -- STATS ChipPAC Ltd. ("STATS ChipPAC") (SGX-ST: STATSChP) (SGX: S24) today announced implementation of breakthrough performance and packaging innovation in multiple advanced chipsets for the rapidly developing smartphone market in China. Spreadtrum Communications, a leading fabless semiconductor provider in China, has adopted STATS ChipPAC's packaging innovations for a number of its mobile chipsets. The combination of Spreadtrum's advanced silicon design capabilities with STATS ChipPAC's next generation embedded Wafer Level Ball Grid Array (eWLB) packaging technology offers increased performance and compact form factor at a competitive cost for the fast-growing China smartphone market.

Spreadtrum offers mobile chipsets for a range of smartphones, feature phones and other consumer electronics products that support 2G, 3G and 4G wireless communications standards. Spreadtrum's TD-SCDMA (time division synchronous code division multiple access) chipsets have set a new standard for increased performance and size reduction in the highly competitive smartphone market in China. TD-SCDMA is a 3G mobile telecommunications standard that is currently utilized in China to enable data, voice, video and media in mobile phones and internet-enabled devices.

"China is now the single largest smartphone market in the world and is rapidly growing," said Brian Chen, Vice President of Operations at Spreadtrum. "By combining our unique chip architecture and leading TD-SCDMA modem technology with STATS ChipPAC's technology and manufacturing leadership, we have been able to deliver high performance TD-SCDMA chipsets in a package format that continues to provide Spreadtrum and our customers with a clear competitive advantage in the China market."

eWLB is a powerful fan-out wafer level packaging (FOWLP) technology and integration platform that provides significant advantages including a more space-efficient package design enabling a smaller footprint, higher density input/output (IO) and a lower package height than is possible with laminate or flip chip semiconductor packages. Spreadtrum and STATS ChipPAC are jointly working to utilize innovative packaging technology across a full spectrum of complex product designs such as dual and quad core mobile processors.

"Our extensive collaboration with Spreadtrum demonstrates the transformative advantages of eWLB technology. We have been able to rapidly optimize the overall functional performance of their silicon with an innovative packaging technology designed to optimize speed, performance and size at an overall lower cost of ownership," said Dr. Han Byung Joon, Executive Vice President and Chief Technology Officer, STATS ChipPAC. "Spreadtrum's success in China and beyond is evident by the numerous product introductions and global customer wins they have had and we are excited to be working together to drive innovations in the smartphone market."

Forward-Looking Statements
Certain statements in this release are forward-looking statements that involve a number of risks and uncertainties that could cause actual results to differ materially from those described in this release. Factors that could cause final actual results to differ include, but are not limited to, the amount of the business interruption insurance claim due to flooding of the Thailand Plant; the ability to shift production to other manufacturing locations, shortages in supply of key components and disruption in supply chain; general business and economic conditions and the state of the semiconductor industry; prevailing market conditions; demand for end-use applications products such as communications equipment, consumer and multi-applications and personal computers; decisions by customers to discontinue outsourcing of test and packaging services; level of competition; our reliance on a small group of principal customers; our continued success in technological innovations; pricing pressures, including declines in average selling prices; intellectual property rights disputes and litigation; our ability to control operating expenses; our substantial level of indebtedness and access to credit markets; potential impairment charges; availability of financing; changes in our product mix; our capacity utilisation; delays in acquiring or installing new equipment; limitations imposed by our financing arrangements which may limit our ability to maintain and grow our business; returns from research and development investments; changes in customer order patterns; customer credit risks; disruption of our operations; loss of key management or other personnel; defects or malfunctions in our testing equipment or packages; rescheduling or cancelling of customer orders; adverse tax and other financial consequences if the taxing authorities do not agree with our interpretation of the applicable tax laws; classification of our Company as a passive foreign investment company; our ability to develop and protect our intellectual property; changes in environmental laws and regulations; exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; majority ownership by Temasek Holdings (Private) Limited ("Temasek") that may result in conflicting interests with Temasek and our affiliates; unsuccessful acquisitions and investments in other companies and businesses; labour union problems in South Korea; uncertainties of conducting business in China and changes in laws, currency policy and political instability in other countries in Asia; natural calamities and disasters, including outbreaks of epidemics and communicable diseases; the continued trading and listing of our ordinary shares on the Singapore Exchange Securities Trading Limited ("SGX-ST"). You should not unduly rely on such statements. We do not intend, and do not assume any obligation, to update any forward-looking statements to reflect subsequent events or circumstances.

About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing or customer support offices throughout Asia, the United States and Europe. STATS ChipPAC is listed on the SGX-ST. Further information is available at www.statschippac.com. Information contained in this website does not constitute a part of this release.

Add to Digg Bookmark with del.icio.us Add to Newsvine

Investor Relations Contact:
Tham Kah Locke
Vice President of Corporate Finance
STATS ChipPAC
Tel: (65) 6824 7788
Fax: (65) 6720 7826
email: Email Contact

Media Contact:
Lisa Lavin
Deputy Director of Marketing Communications
STATS ChipPAC
Tel: (208) 867-9859
email: Email Contact

About Marketwired .
Copyright © 2009 Marketwired. All rights reserved. All the news releases provided by Marketwired are copyrighted. Any forms of copying other than an individual user's personal reference without express written permission is prohibited. Further distribution of these materials is strictly forbidden, including but not limited to, posting, emailing, faxing, archiving in a public database, redistributing via a computer network or in a printed form.

Latest Cloud Developer Stories
Today's datacenters face a gauntlet of challenges including protection of physical and virtual environments, fast recovery of data, reducing backup times and storage requirements, server consolidation, and disaster recovery. How are savvy CIOs conquering these types of challenges...
Scott Jenson leads a project called The Physical Web within the Chrome team at Google. Project members are working to take the scalability and openness of the web and use it to talk to the exponentially exploding range of smart devices. Nearly every company today working on the ...
CodeFutures, a provider of agile Big Data technologies, on Tuesday announced the release of Cory Isaacson’s newest book, “Understanding Big Data Scalability.” Isaacson is the CEO/CTO for CodeFutures and an industry-leading innovator of data management software. “Understanding Big...
Cloud Computing is evolving into a Big Three of Amazon Web Services, Google Cloud, and Microsoft Azure. Cloud 360: Multi-Cloud Bootcamp, being held Nov 4–5, 2014, in conjunction with 15th Cloud Expo in Santa Clara, CA, delivers a real-world demonstration of how to deploy and co...
Avaya has escalated its efforts to get customers to fast-track to the cloud with the first of several sweeping initiatives that will optimize solutions and processes for delivery of collaboration as a service (CaaS) via the Avaya Collaborative Cloud. Strong demand for Avaya commu...
Subscribe to the World's Most Powerful Newsletters
Subscribe to Our Rss Feeds & Get Your SYS-CON News Live!
Click to Add our RSS Feeds to the Service of Your Choice:
Google Reader or Homepage Add to My Yahoo! Subscribe with Bloglines Subscribe in NewsGator Online
myFeedster Add to My AOL Subscribe in Rojo Add 'Hugg' to Newsburst from CNET News.com Kinja Digest View Additional SYS-CON Feeds
Publish Your Article! Please send it to editorial(at)sys-con.com!

Advertise on this site! Contact advertising(at)sys-con.com! 201 802-3021



SYS-CON Featured Whitepapers
ADS BY GOOGLE