|
Comments
Did you read today's front page stories & breaking news?
SYS-CON.TV
|
From the Wires
Rambus Invited to Demonstrate and Present Innovations for Future Main Memory at ISSCC 2013
By: Business Wire
Feb. 19, 2013 04:15 PM
Rambus Inc.(NASDAQ: RMBS):
Rambus engineers will demonstrate and present innovations for future main memory systems at the 2013 International Solid-State Circuit Conference (ISSCC), the premier forum for showcasing advances in solid-state circuits. The presentation will highlight a single-ended, low-signal swing transceiver that couples high-speed (up to 6.4Gb/s) read/write capabilities with industry leading power efficiency. This technology can satisfy the demand for high-density, low power and high-speed memory interfaces in cloud computing environments. Demonstration Session Details:
Title: A 6.4Gb/s Near-Ground Single-Ended Transceiver for
Dual-Rank DIMM Memory Interface Systems For additional details, visit: www.rambus.com.
Latest Cloud Developer Stories
Subscribe to the World's Most Powerful Newsletters
Subscribe to Our Rss Feeds & Get Your SYS-CON News Live!
|
SYS-CON Featured Whitepapers
Most Read This Week
Breaking Cloud Computing News
|
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||