From the Wires
Rambus Invited to Demonstrate and Present Innovations for Future Main Memory at ISSCC 2013
By: Business Wire
Feb. 19, 2013 04:15 PM
Rambus Inc.(NASDAQ: RMBS):
Rambus engineers will demonstrate and present innovations for future main memory systems at the 2013 International Solid-State Circuit Conference (ISSCC), the premier forum for showcasing advances in solid-state circuits.
The presentation will highlight a single-ended, low-signal swing transceiver that couples high-speed (up to 6.4Gb/s) read/write capabilities with industry leading power efficiency. This technology can satisfy the demand for high-density, low power and high-speed memory interfaces in cloud computing environments.
Demonstration Session Details:
Title: A 6.4Gb/s Near-Ground Single-Ended Transceiver for
Dual-Rank DIMM Memory Interface Systems
For additional details, visit: www.rambus.com.
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